发明名称 半導体装置
摘要 A semiconductor device includes at least one semiconductor chip, a gate wiring connected to the at least one semiconductor chip, a first wiring connected to the at least one semiconductor chip, and a second wiring connected to the at least one semiconductor chip. The first and second wirings extend along the gate wiring. The first wiring is arranged between the gate wiring and second wiring. The first wiring is the wiring closest to the gate wiring. A first part of the gate wiring opposing the first wiring is shorter than a second part of the gate wiring opposing the second wiring.
申请公布号 JP5991045(B2) 申请公布日期 2016.09.14
申请号 JP20120145146 申请日期 2012.06.28
申请人 住友電気工業株式会社 发明人 道越 久人;平方 宣行;野津 浩史
分类号 H01L25/07;H01L25/18 主分类号 H01L25/07
代理机构 代理人
主权项
地址