发明名称 熱膨張性マイクロカプセル
摘要 PROBLEM TO BE SOLVED: To provide a thermally expansible microcapsule excellent in storage stability, and capable of being suitably used for molding in which a strong shear force is applied, and to provide a method for manufacturing the thermally expansible microcapsule.SOLUTION: A thermally expansible microcapsule contains a gas-barrier polymer and a pyrolyzable solid polymer, wherein the weight loss rate after being heated at 100°C for 15 min is ≤1%, and the weight loss rate after being heated at 200°C for 15 min is ≥5%; the gas-barrier polymer is a polymer obtained by polymerizing at least one gas-barrier monomer selected from the group consisting of acrylonitrile, methacrylonitrile and vinylidene chloride; and the gas-barrier polymer is contained in ≥30 wt.%.
申请公布号 JP5991851(B2) 申请公布日期 2016.09.14
申请号 JP20120111790 申请日期 2012.05.15
申请人 積水化学工業株式会社 发明人 山内 博史
分类号 C09K3/00;B01J13/02;C08F220/18;C08F220/28;C08F220/42 主分类号 C09K3/00
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