| 摘要 |
PROBLEM TO BE SOLVED: To provide a control device which inhibits heat of a heat sink from affecting a component.SOLUTION: A control device 1 includes: a heat sink 7 having an attachment surface 7a; a first substrate 9 facing the attachment surface 7a; a power module 13A which is mounted on the first substrate 9 and adheres to a first region 7aa from among the attachment surface 7a; a component 13B which is mounted on the first substrate 9, is at least partially positioned in a second region 7ab at the outer side of the first region 7aa when viewed in a facing direction of the attachment surface 7a and the first substrate 9, and has a smaller heat value than the power module 13A; and a heat insulation member 25 which is at least partially positioned in at least a part of a space between the second region 7ab and the component 13B. |
