发明名称 |
METHOD AND ARRANGEMENT FOR BOARD-TO-BOARD INTERCONNECTION |
摘要 |
A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side. |
申请公布号 |
EP3063829(A1) |
申请公布日期 |
2016.09.07 |
申请号 |
EP20130896519 |
申请日期 |
2013.11.01 |
申请人 |
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) |
发明人 |
ZHOU, BO;CHEN, JUNYOU;LIU, KUN |
分类号 |
H01Q1/38 |
主分类号 |
H01Q1/38 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|