| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element which can ensure endurance for use in flip-chip mounting.SOLUTION: In a semiconductor element including bumps 60 each having a step-like shape as bump electrodes for flip-chip mounting, the bump 60 includes a first bump part 61 which forms a first stage of the step-like shape, a second bump part 63 which forms a second stage of the step-like shape and a first coating layer 62 which is formed by a formation material different from a formation material of the first bump part 61 and which is at least arranged so as to lie between the first bump part 61 and the second bump part 63. |
