发明名称 |
SEMICONDUCTOR PACKAGE ASSEMBLY |
摘要 |
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a redistribution layer (RDL) structure die-attach surface and a bump-attach surface opposite the die-attach surface. A semiconductor die is mounted on the die-attach surface of the redistribution layer (RDL) structure. A first solder mask layer is disposed on the die-attach surface. The first solder mask layer surrounds the semiconductor die. An additional circuit structure is disposed on a portion of the first solder mask, surrounding the semiconductor die. The additional circuit structure comprises a pad portion having a first width and a via portion has a second width that is less than the first width. The via portion passes through the first solder mask layer to be coupled the redistribution layer (RDL) structure. |
申请公布号 |
EP3065173(A1) |
申请公布日期 |
2016.09.07 |
申请号 |
EP20160158447 |
申请日期 |
2016.03.03 |
申请人 |
MEDIATEK, INC |
发明人 |
HSIEH, TUNG-HSIEN;CHOU, CHE-YA |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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