Semiconductor device

摘要

A semiconductor device and a method of making the same. The device includes an electrically conductive heat sink (8) having a first surface. The device also includes a semiconductor substrate (2). The device further includes a first contact (14) located on a first surface of the semiconductor substrate (2). The device also includes a second contact (16) located on a second surface of the semiconductor substrate (2). The first surface of the semiconductor substrate (2) is mounted on the first surface of the heat sink (8) for electrical and thermal conduction between the heat sink (8) and a substrate via the first contact (14). The second surface of the semiconductor substrate (2) is mountable on a surface of a carrier.