| 摘要 |
A microelectromechanical system (MEMS) microphone includes a base having a port extending there through. A MEMS die is coupled to the base, and the MEMS die includes a diaphragm and a back plate. An application specific integrated circuit (ASIC) is coupled to the base and the MEMS die. A cover is coupled to the base, and the cover includes customer pads. The customer pads on the cover are connected electrically to the ASIC, and the cover is arranged to form an air tight seal with the base and enclose the MEMS die and the ASIC. The microphone is connected to a customer board at the cover and arranged such that sound enters through the port in the base. |
