发明名称 基板配線構造
摘要 PROBLEM TO BE SOLVED: To provide a substrate wiring structure for inserting the wiring into holes formed in an electronic substrate, or the like, which allows for enhancement of workability of substrate wiring work and product cost reduction.SOLUTION: A substrate wiring structure arranges a display 20, a bracket 30, and an electronic substrate 40 so as to be stacked sequentially, inserts the wiring 22 of the display 20 sequentially into a bracket hole 51 formed in the bracket 30 and a substrate hole 43 formed in the electronic substrate 40, leads out the wiring to reach the surface of the electronic substrate 40 on the reverse side of the bracket 30, and connects the wiring with an object electronic component 41 provided on the surface of the electronic substrate 40 on the reverse side. A rising portion 52 for rising the wiring 22, inserted into the bracket hole 51, in the direction leading to the substrate hole 43 from the surface of the bracket 30 is provided on the periphery of the bracket hole 51 in the bracket 30.
申请公布号 JP5987748(B2) 申请公布日期 2016.09.07
申请号 JP20130069768 申请日期 2013.03.28
申请人 アイシン・エィ・ダブリュ株式会社 发明人 金森 隆一郎;川上 慎司
分类号 H05K7/00;B60K35/00;G09F9/00 主分类号 H05K7/00
代理机构 代理人
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