| 摘要 |
A heat sink 18 for power electronic applications comprises a first plate member 38, an opposing second member 40 and side walls 44 defining a fluid space 20. A fluid inlet and a fluid outlet allow fluid to be passed through the fluid space. Internal fluid passageways within the fluid space allow fluid to circulate through or around a plurality of pins, fins or projections 42 that extend from, and that are attached to, or are integral with, the first plate member. The first plate member has a thickness in at least 50% of the areas between the pins, fins or projections, not exceeding 1mm and no less than 0.2 mm. The first plate is thin, which allows a quick transfer of heat from the power electronic device 12. The structural rigidity of the device is maintained by the projections 42 and the second plate 40. A method of manufacturing the heatsink comprises attaching at least 50% of the pins, fins or projections to both the first plate member and the opposing second member. A method of cooling power electronics, a battery or an IGBT arrangement comprises mounting the respective arrangement on the heatsink and passing fluid through the heatsink. |
