| 摘要 |
PROBLEM TO BE SOLVED: To provide an embossment carrier tape molding die in which when molding an embossment carrier tape, stress heterogeneity generating in the tape can be dissolved.SOLUTION: An embossment carrier tape molding die includes: a first mold 21 having strippers 21A and two or more draw punches 21B that are supported by the strippers 21A and disposed in parallel in a feed direction with a prescribed pitch, and form recesses 12 in a resin substrate 11; and a second mold 22 that includes dies 22A having first holes 22B in which the draw punches 21B can be inserted. The stripper 21A includes extension parts 21U and 21L extending from a proximity draw punch by at least a prescribed pitch length at respective ends of upstream and downstream sides, the die 22A includes extension parts 22U and 22L extending from a proximity first hole 22B by at least a prescribed pitch length at respective ends of upstream and downstream sides, and a second hole 22C is formed at the extension part 22L to be alienated from the proximity first hole 22B by a prescribed pitch. |
