发明名称 |
基板貫通相互接続を有する半導体構成と、基板貫通相互接続を形成する方法 |
摘要 |
Some embodiments include methods of forming interconnects through semiconductor substrates. An opening may be formed to extend partway through a semiconductor substrate, and part of an interconnect may be formed within the opening. Another opening may be formed to extend from a second side of the substrate to the first part of the interconnect, and another part of the interconnect may be formed within such opening. Some embodiments include semiconductor constructions having a first part of a through-substrate interconnect extending partially through a semiconductor substrate from a first side of the substrate; and having a second part of the through-substrate interconnect extending from a second side of the substrate and having multiple separate electrically conductive fingers that all extend to the first part of the interconnect. |
申请公布号 |
JP5989104(B2) |
申请公布日期 |
2016.09.07 |
申请号 |
JP20140514461 |
申请日期 |
2012.05.03 |
申请人 |
マイクロン テクノロジー, インク. |
发明人 |
ウッド,アラン ジー.;アイルランド,フィリップ ジェイ. |
分类号 |
H01L21/3205;H01L21/768;H01L23/12;H01L23/522 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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