| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having high heat dissipation in a vertical direction.SOLUTION: Since a through-hole 20 of a core substrate 30 is equipped with a heat dissipation block 80, heat dissipation in a vertical direction is high and heat of mounted IC chip 90 can be efficiently dissipated to a mounted mother board 98 side. Since a copper heat dissipation block is housed only in the through-hole 20, copper occupancy of a whole printed wiring board is low, and a build-up layer laminated alternately with a resin insulation layer and a conductor layer is hardly warped. |
