| 发明名称 |
SEPARATING A WAFER OF LIGHT EMITTING DEVICES |
| 摘要 |
Embodiments of the invention are directed to a method of separating a wafer of light emitting devices. The method includes scribing a first groove on a dicing street on the wafer and checking the alignment of the wafer using a location of the first groove relative to a feature on the wafer. After checking the alignment, a second groove is scribed on the dicing street. |
| 申请公布号 |
EP3063794(A1) |
申请公布日期 |
2016.09.07 |
| 申请号 |
EP20140802185 |
申请日期 |
2014.10.21 |
| 申请人 |
KONINKLIJKE PHILIPS N.V. |
发明人 |
PEDDADA, RAO S.;WEI, FRANK LILI |
| 分类号 |
H01L33/00;B23K26/04;B23K26/40;B28D5/00;G01N21/88;H01L21/304;H01L21/78;H01L21/8252;H01S5/02 |
主分类号 |
H01L33/00 |
| 代理机构 |
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