发明名称 シリカ粒子、その製造方法および半導体実装用ペースト
摘要 PROBLEM TO BE SOLVED: To provide a silica particle that hardly releases α rays, has excellent dispersibility in resin, and can be contained in a semiconductor mounting paste.SOLUTION: The present invention relates to a silica particle in which the ratio of uranium mass to silicon oxide mass (in terms of SiO) is 2 ppb or less (U/SiO), the ratio of thorium mass to silicon oxide mass (in terms of SiO) is 2 ppb or less (Th/SiO), the ratio of alkali metal element mass to silicon oxide mass (in terms of SiO) is 10-1000 ppm (alkali metal element/SiO), and an average particle diameter measured by a dynamic light scattering method is 10 nm-10 μm.
申请公布号 JP5989209(B2) 申请公布日期 2016.09.07
申请号 JP20150174121 申请日期 2015.09.03
申请人 日揮触媒化成株式会社 发明人 熊澤 光章;宮本 卓児;若宮 義徳;荒尾 弘樹
分类号 C01B33/193;C08L101/00;H01L23/29;H01L23/31 主分类号 C01B33/193
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