| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate for a power module with a heat sink which reduces warpage of the substrate for the power module with the heat sink that includes a substrate for the power module, where a circuit layer and a metal layer, which are made of metals different from each other, are respectively formed on one surface and the other surface of an insulation layer, and the heat sink for a relatively short time at low costs.SOLUTION: A manufacturing method of a substrate for a power module with a heat sink includes: a circuit layer formation process where a circuit layer 12 is formed on one surface of an insulation layer 11; a metal layer formation process where a metal layer 13 made of a metal different from the circuit layer 12 is formed on the other surface of the insulation layer 11; and a heat sink joint process where the heat sink 31 is joined to the metal layer 13 side. In the heat sink joint process, the circuit layer 12, the insulation layer 11, the metal layer 13, and the heat sink 31 are laminated and heated while being pressurized in a lamination direction to be joined. Then, those components are cooled to a temperature lower than a normal temperature while being pressurized in the lamination direction. |
