| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having excellent low water absorption and low thermal expansion properties, and a prepreg, laminate, and printed wiring board prepared therewith.SOLUTION: A thermosetting resin composition comprises (a) maleimide compound having at least two N-substituted maleimide groups in one molecule, (b) silicone compound having an acidic substituent in a molecular structure, and (c) thermosetting resin.SELECTED DRAWING: None |
