| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern forming method capable of forming a pattern with excellent precision through an easier process, a pattern formed by the method, and a device provided with the pattern and a semiconductor element.SOLUTION: The pattern forming method comprises: a step (1) of forming a hydrophilic photosensitive resin layer on a substrate; a step (2) of irradiating the hydrophilic photosensitive resin layer with light to previously modify a surface of a peripheral part of an edge, which is adjacent to the edge of a set pattern shape; a step (3) of exposing the substrate after irradiated with light to a liquid or gas comprising a fluorine-based compound to impart water repellency to the surface of the peripheral part of the edge; and a step (4) of arranging an ink liquid in a region of the patten shape, which is zoned by the peripheral part of the edge having the water-repellent surface. A conductive pattern is formed by the pattern forming method, and a device (for instance, non-contact IC card) is formed by mounting a semiconductor element thereon. |
