| 摘要 |
PROBLEM TO BE SOLVED: To provide means for reducing thermal gradient in the whole of a mold.SOLUTION: A semiconductor device encapsulation mold comprises: an upper mold 10 constituted of a first upper mold 11 and a second upper mold 12; a lower mold 20 constituted of a first lower mold 21 and a second lower mold 22; a plunger 31 disposed so as to be freely movable in a pot part 30; a product part 35 transfer-molding a semiconductor element with an encapsulation resin material; a cull part 36 adjusting a volume of the filled encapsulation resin material; and a gate part connecting between the product part and the cull part. The semiconductor device encapsulation mold comprises: a first heat source 32 disposed to the first upper mold in the vicinity of the cull part; and a second heat source 32 disposed to the first lower mold while being apart from the first heat source so as to cover in a horizontal or vertical direction to the product part. Since the second upper mold and the second lower mold are made of a material having a more excellent thermal insulation property than that of the first upper mold and the first lower mold, a temperature of the whole of the mold can be raised in a short time, and release of heat to the exterior of the mold can be suppressed. |
