| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can stably activate a semiconductor element.SOLUTION: A wiring board A comprises: a base wiring board 10 including an element mounting part 1a and a frame-like frame bonding part 1b which surrounds the element mounting part 1a; and a frame wiring board 20 having an opening 15 which surrounds the element mounting part 1a, in which a first bonding pad 6 on a top face of the frame bonding part 1b and a second bonding pad 16 on an undersurface of the frame wiring board 20 are bonded and an encapsulation resin 18 is filled between the base wiring board 10 and the frame wiring board 20. The wiring board A further comprises: a solder resist layer 4 which exposes the first bonding pad 6 and which is deposited from the element mounting part 1a to the frame bonding part 1b; and a frame-like projection 9 formed on the frame bonding part 1b in the solder resist layer 4, in which the encapsulation resin 18 is housed so as not to outflow on the solder resist layer 4 inside the projection 9. |
