| 摘要 |
A semiconductor chip 100 for measuring a magnetic field, the semiconductor chip comprises a magnetic sensing element 110 and an electronic circuit 120, wherein: the magnetic sensing element 110 is mounted on the electronic circuit 120; the magnetic sensing element 110 is electrically connected with the electronic circuit 120; the electronic circuit 120 is produced in a first technology and/or first material and the magnetic sensing element 110 is produced in a second technology and/or second material different from the first technology / material. Also disclosed is a method of making the above semiconductor chip 100, the method comprising manufacturing at least one target device comprising the electronic circuit 120 on a first wafer; manufacturing at least one source device comprising the magnetic sensing element 110 on a second wafer, where the second material has a higher carrier mobility than the first material at room temperature; transferring the at least one target device to the at least one source device comprising the steps of: covering a landed area of the target device with an adhesive; lifting-off the source device from the second wafer using a transfer element; positioning the source device onto the landed area; lifting-off the transfer element from the source device; and connecting the source device electrically to the target device. |
