| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a measurement instrument, which achieve downsizing and reduction in wiring resistance.SOLUTION: A semiconductor device comprises: a lead frame; an oscillator which includes a plurality of terminals spaced at predetermined intervals and which is mounted on an oscillator mounting region formed on a first surface of the lead frame and having a width narrower than an interval between the terminals; an integrated circuit mounted on a second surface of the lead frame on an opposite side to the first surface; and bonding wires for connecting the terminals of the oscillator and terminals of the integrated circuit. The oscillator and the integrated circuit overlaps each other in planar projection, and the terminals of the oscillator are arranged to be exposed on the second surface of the lead frame. |
