发明名称 |
THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM |
摘要 |
A thermal management circuit material comprises a thermally conductive metallic core substrate, metal oxide dielectric layers on both sides of the metallic core substrate, electrically conductive metal layers on the metal oxide metal oxide dielectric layers, and at least one through-hole via filled with an electrically conductive metal-containing core element connecting at least a portion of each of the electrically conductive metal layers, wherein the containing walls of the through-hole via are covered by a metal oxide dielectric layer connecting at least a portion of the metal oxide dielectric layers on opposite sides of the metallic core substrate. Also disclosed are methods of making such circuit materials, comprising forming metal oxide dielectric layers by oxidative conversion of a surface portion of the metallic core substrate. Articles having a heat-generating electronic device such as an HBLED mounted in the circuit material are also disclosed. |
申请公布号 |
EP3061128(A1) |
申请公布日期 |
2016.08.31 |
申请号 |
EP20140793734 |
申请日期 |
2014.10.24 |
申请人 |
ROGERS CORPORATION |
发明人 |
KILHENNY, Brett W.;SHASHKOV, Pavel;USOV, Sergey;CURTIS, Steven |
分类号 |
H01L23/367;H01L21/48;H01L23/373;H01L23/498;H01L33/62;H01L33/64;H05K1/05;H05K3/46 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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