发明名称 エッチング液、これを用いたエッチング方法、エッチング液のキット、および半導体基板製品の製造方法
摘要 An etching liquid which removes a metallic layer disposed on the upper side of a silicide layer, and contains: hydrochloric acid; nitric acid; a sulphonic acid compound; a metal corrosion inhibitor that comprises a compound including a heteroatom; and water. The nickel solubility ratio of a chemical solution not including the metal corrosion inhibitor, to a chemical solution including the metal corrosion inhibitor is 20% or more. (Nickel solubility: nickel powder is added to the etching liquid, and processed for 10 minutes at 60°C. The dissolved concentration of nickel present in the resulting liquid.) Nickel solubility ratio (%) = {1-Sb/Sa}×100. Sa: nickel solubility where the corrosion inhibitor is not included. Sb: nickel solubility where the corrosion inhibitor is included.
申请公布号 JP5980717(B2) 申请公布日期 2016.08.31
申请号 JP20130097154 申请日期 2013.05.02
申请人 富士フイルム株式会社 发明人 高橋 智美;上村 哲也;稲葉 正
分类号 H01L21/308;C23F1/28;C23F1/30;H01L21/28;H01L21/306;H01L21/336;H01L29/417;H01L29/78 主分类号 H01L21/308
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