| 摘要 |
PURPOSE:To obtain a load needed for bonding and enable shock load to be reduced by performing ball bonding to a bonding pad of one pellet and stitch bonding to the bonding pad of the other pellet through a protruding electrode. CONSTITUTION:A pellet 2 is mounted to an island 1 of a lead frame. Then, stitch bonding is performed to a bonding pad 3 of the pellet 2. In this case, stitch bonding is performed on an aluminum electrode of the bonding pad 3 through a protruding electrode 4. The protruding electrode 4 interposed between the bonding pad 3 and a gold wire 5 can be produced by many bump-forming technologies. |
