| 摘要 |
A thermoelectric device (1) for transferring heat from a heat source (2) to a heat sink (3) comprises a first thermoelectric leg pair (10) having a first leg (4) including an n-type semiconductor material and a second leg (5) including a p-type semiconductor material, wherein the first leg (4) and the second leg (5) are electrically coupled in series. A second thermoelectric leg pair (11) has a third leg (7) including an n-type semiconductor material and a fourth leg (8) including a p-type semiconductor material, wherein the third leg (7) and the fourth leg (8) are electrically coupled in series. A first contact (12) placed between the first leg (4) and the fourth leg (8); and a second contact (13) placed between the second leg (5) and the third leg (7). A method for manufacturing a thermoelectric device or module comprises the steps of: providing a first thermoelectric leg pair (10) having a first leg (4) including an n-type semiconductor material and a second leg (5) including a p-type semiconductor material; electrically coupling the first leg (4) and the second leg (5) of the first thermoelectric leg pair (10) in series; providing a second thermoelectric leg pair (11) having a third leg (7) including an n-type semiconductor material and a fourth leg (8) including a p-type semiconductor material; electrically coupling the third leg (7) and the fourth leg (8) of the second thermoelectric leg pair (11) in series; placing a first contact (12) between the first leg (4) and the fourth leg (8); and placing a second contact (13) between the second leg (5) and the third leg (7). |
