发明名称 |
RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND PRINTED CIRCUIT BOARD |
摘要 |
An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E). |
申请公布号 |
EP2927278(A4) |
申请公布日期 |
2016.08.31 |
申请号 |
EP20130857760 |
申请日期 |
2013.11.27 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
CHIBA, TOMO;TAKAHASHI, HIROSHI;SHIGA, EISUKE;KATO, YOSHIHIRO |
分类号 |
C08L63/00;B32B15/092;B32B15/14;B32B15/20;C08F283/12;C08G73/06;C08J5/24;C08K3/00;C08K5/315;C08K5/3415;C08K5/3445;C08L51/08;C08L55/00;C08L61/04;C08L61/06;C08L79/08;H05K1/03 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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