发明名称 Multi-layer board
摘要 The plate (1) has a heat conductive plate (2) made of a material with high heat conductivity. The conductive plate comprises a channel (3) for accommodation of a pipe (4) for a heat transfer medium. The conductive plate is connected to an insulating plate and/or embedded in the insulating plate. The channel comprises latches (9) for snapping accommodation and/or locking accommodation of the pipe at opposite channel walls (18). The plate (1) is factory made without accommodated pipe and is provided for bringing the pipe into the channels.
申请公布号 EP2169317(B8) 申请公布日期 2016.08.31
申请号 EP20080016842 申请日期 2008.09.25
申请人 ROTH WERKE GMBH 发明人
分类号 F24D3/14 主分类号 F24D3/14
代理机构 代理人
主权项
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