| 摘要 |
The present invention provides a peeling apparatus and a peeling method for laminate, and a manufacturing method of an electronic device, capable of improving fixing workability of a connection member with respect to a flexible plate while preventing the breakage of the laminate. The peeling apparatus for the laminate sequentially peels the laminate from one end part of an interface between a first substrate and a second substrate toward the other end part of the interface, wherein the laminate includes the first substrate and the second substrate, in which the first substrate is adhered to the second substrate in a separable state. The peeling apparatus for the laminate includes: a support part for supporting the first substrate of the laminate; a flexible plate for vacuum-adsorbing the second substrate of the laminate at an adsorption surface thereof; and a movable body fixed to a surface opposite to the adsorption surface of the flexible plate through a connection member for performing bending deflection on the flexible plate by independently moving with respect to the support part, and sequentially peeling the laminate at the interface. The connection member is inserted through a through-hole included in the flexible plate, a shielding member is disposed between a space formed on the flexible plate by the through-hole and the second substrate adsorbed to the flexible plate, and vacuum suction force of the flexible plate with respect to the space is blocked by the shielding member. |
