| 摘要 |
The present invention provides a peeling apparatus and a peeling method for a laminate, and a manufacturing method of an electronic device, capable of peeling a first substrate from a second substrate with a few numbers of moving bodies. In the peeling apparatus for the laminate, for sequentially peeling the laminate from one end part of an interface between a first substrate and a second substrate toward the other end part of the interface, wherein the laminate includes the first substrate and the second substrate, and the first substrate is attached to the second to be able to be separated therefrom. The present invention relates to the peeling apparatus for the laminate, including: a support part for supporting the first substrate of the laminate; a flexible plate for adsorbing the second substrate of the laminate at an adsorption surface of the second substrate; and a plurality of movable bodies installed at a surface opposite to the adsorption surface of the flexible plate for performing bending deflection on the flexible plate from one end side toward the other end side by independently moving with respect to the support part, and sequentially peeling the laminate from the interface. The plurality of movable bodies are installed at the flexible plate through a plurality of connection members as a unit of single movable body or multiple movable bodies. |
