| 摘要 |
The invention provides a wafer stripping device which strips wafers from a slice base. The wafer stripping device strips a plurality of wafers which are adhered to the slice base by an adhesive. The device comprises a groove storing liquid, a first nozzle which injects liquid towards the side surfaces of the plurality of wafers which are soaked in the liquid of the groove by the slice base, a tray which is configured in the groove and holds the wafers stripped from the slice base, and an attraction port which attracts liquid in the tray through opening portions on the side surface and the bottom surface of the tray. |
