| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition giving a cured film being excellent in cured film elongation and allowing suppression of wrinkle occurrence in a metal film and a cured product by sputtering treatment; a cured relief pattern-manufacturing method to form a pattern using the photosensitive resin composition; a semiconductor device; and a display device.SOLUTION: A photosensitive insulating resin composition contains a phenol resin (A) having a structure represented by the general formula (1), a photoacid-generating agent (B), a solvent (C) and a crosslinking agent (D) [in the formula (1), a is an integer of 2 or 3; b is an integer of 0 to 2; 2≤(a+b)≤4 is satisfied; Rrepresents a monovalent substituent selected from the group consisting of a monovalent organic group having a carbon number of 1 to 20, a halogen atom, a nitro group and a cyano group; and X represents a divalent organic group selected from the group consisting of a divalent chain aliphatic group having a carbon number of 2 to 10, a divalent alicyclic group having a carbon number of 3 to 20, an alkylene oxide group, and a divalent organic group having an aromatic ring]. |
