| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which retains credibility in the operation under a high temperature, is compatible with a device that is easily influenced by α ray, and is excellent in fluidity, package warpage and thermal conductivity, and to provide an electronic component device using the same.SOLUTION: An epoxy resin composition contains an epoxy resin (A), a phenol resin (B), a hardening accelerator (C) and a spherical alumina (D). As for the spherical alumina (D), the average particle diameter D50 with 50 wt.% as accumulated from a fine particle side is 2 μm or greater and 55 μm or less in a particle size distribution measured by a laser diffraction scattering method, and a specific surface area measured by a nitrogen adsorption method is 1.0 m/g or less, and the total amount of uranium and thorium is 10 ppb or less. Also provided is an electronic component device, an element of which is sealed by a cured material of the epoxy resin composition. |
