| 摘要 |
A polishing composition for a silicon wafer of the present invention includes: 0.01 to 0.5 mass% of silica particles; a nitrogen-containing basic compound; and a water-soluble polymer, wherein the water-soluble polymer includes a constitutional unit represented by a general formula (1) below:
and in the water-soluble polymer, a ratio of the number of oxygen atoms derived from hydroxyl groups to the number of oxygen atoms derived from polyoxyalkylene (the number of oxygen atoms derived from hydroxyl groups / the number of oxygen atoms derived from polyoxyalkylene) is in a range from 0.8 to 10. The water-soluble polymer is preferably at least one kind selected from the group consisting of polyglycidol, a polyglycidol derivative, polyglycerin, a polyglycerin derivative, and a polyvinyl alcohol-polyethylene glycol graft copolymer having polyvinyl alcohol as a side chain. |
