| 摘要 |
A method of applying a pattern formed of at least two different materials to a substrate 50 is provided. The method comprises providing a die form 101 with a surface that comprises a plurality of recesses 102 defining the pattern, applying a first curable material, partially filling the plurality of recesses and applying a second curable material to the plurality of recesses. Removing the first and second curable material that is not in the recesses from the surface of the die form. The die form is then brought into contact with the pattern support layer such that the material in the recesses is transferred from the recesses to pattern support layer. The two materials are at least partly cured during the process. Also disclosed is a method of applying a pattern formed of at least two different materials to a pattern support layer where the material are applied to recesses in the support layer. Also disclosed is a security element. |
