フリット密封システム及び方法

摘要

A frit sealing system for combining a first substrate (101) and a second substrate (102) using frit (103) comprises a laser (123) generating a laser beam, and a homogenizer (127) normalizing the intensity of the laser beam within a cross section of the laser beam in the transverse direction. The frit sealing system further comprises a support apparatus (118) configured to hold a first and a second substrate with frit interposed between them, wherein the frit is configured to be cured by heat generated from the laser beam and thereby solidifying and binding the first and the second substrates.