| 摘要 |
The present invention relates to a deposition system capable of performing chemical vapor deposition on a flexible substrate, comprising: a vaporization source, a vacuum chamber, a substrate providing device and a substrate cooling device. The vaporization source vaporizes a deposition material to be deposited. The vacuum chamber has the vaporization source positioned inside and provides a space for depositing the deposition material. The substrate providing device is included in the vacuum chamber and provides a flexible substrate, on which the deposition material is deposited. The substrate cooling device is positioned on the lower side of the flexible substrate to reduce heat generated when the deposition material is deposited on the flexible substrate provided by the substrate providing device. The substrate cooling device is positioned on the lower side of the flexible substrate and cools the flexible substrate with cooling gas such that the lower surface of the flexible substrate has no damage, thereby reducing a defect rate. Moreover, the substrate cooling device continuously cools the flexible substrate while a deposition process is performed on the flexible substrate such that cooling efficiency for the flexible substrate can be maintained, and a cooling time can be further shortened, thereby reducing a production process time. The entire flexible substrate is continuously and uniformly cooled at a deposition position where the deposition process is performed, thereby restricting damage to the substrate due to non-uniform cooling. |
