发明名称 |
LAYOUT AND METHOD OF SINGULATING MINIATURE ULTRASONIC TRANSDUCERS |
摘要 |
The present disclosure provides a method of singulating a plurality of miniature ultrasound transducers from a wafer. The method includes receiving a wafer on which a plurality of miniature ultrasound transducers is formed. The miniature ultrasound transducers each include a transducer membrane containing a piezoelectric material. The method includes etching, from a front side of the wafer, a plurality of trenches into the wafer. Each trench at least partially encircles a respective one of the miniature ultrasound transducers in a top view. Each trench includes an approximately rounded segment. The method includes thinning the wafer from a back side opposite the front side. The thinning the wafer is performed such that the trenches are open to the back side. The method includes performing a dicing process to the wafer to separate the miniature ultrasound transducers from one another. The dicing process is performed without making crossing cuts in the wafer. |
申请公布号 |
EP2938267(A4) |
申请公布日期 |
2016.08.24 |
申请号 |
EP20130868830 |
申请日期 |
2013.12.23 |
申请人 |
VOLCANO CORPORATION |
发明人 |
RICE, CHERYL;XI, DONGJUAN CHRIS |
分类号 |
H01L41/09;B06B1/06;H01L41/193;H01L41/338 |
主分类号 |
H01L41/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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