| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting adhesive composition to adhere and fix a flexible wiring board improved in storage stability and moisture-absorption solder heat resistance, to a base material for reinforcement therefor.SOLUTION: A thermosetting adhesive composition contains (A) an acrylic copolymer, (B) an epoxy resin, and (C) a curing agent for the epoxy resin. (A) The acrylic copolymer is the one in which epoxy groups are partially crosslinked by reaction of 65 to 75 mass% of (a) an epoxy group-free (meth)acrylate ester monomer, 20 to 35 mass% of (b) an acrylonitrile monomer, 3 to 15 mass% of (c) an epoxy group-containing (meth)acrylate ester monomer, and 0.05 to 0.5 mass% of (d) a thiol group-containing compound having 1 to 3 thiol groups in the molecule. (C) The curing agent for the epoxy resin is an organic acid dihydrazide having an average particle diameter of 0.5 to 15 μm. |
