COOLING DEVICE

摘要

A cooling device for cooling an electronic component, such as a power semiconductor, includes a cooling body which can be thermally coupled to the component, at least one sonotrode element for generating ultrasonic waves having a predetermined wavelength directed towards the cooling body, and a resonance tube that is associated with the sonotrode element and that is arranged between the sonotrode element and the cooling body, wherein a distance between the sonotrode element and the cooling body corresponds to an integral multiple of a quarter of a wavelength, such that a standing wave is formed between the at least one sonotrode element and the cooling body.