| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method and a plating apparatus which facilitate handling and can resupply Sn components to plating liquid efficiently.SOLUTION: The method comprises: a plating step in which a plating tank 1 for storing plating liquid containing Sn is divided, by an anion-exchange membrane 4, into a cathode chamber 21 where a substrate 2 under treatment is located and an anode chamber 31 where an insoluble anode electrode 3 is located, and plating is applied to the substrate 2 under treatment; a resupply step for generating resupply plating liquid by supplying tin oxide to the anode chamber plating liquid in the anode chamber 31 the acid concentration of which has increased due to the plating step; and an evening step for evening the plating liquid in the plating tank 1 by circulation between the resupply plating liquid and the plating liquid in cathode chamber 21. |
