发明名称 金型幅検出装置及び方法
摘要 PROBLEM TO BE SOLVED: To provide a die width detection apparatus that can detect the width of a die mounted on a die mounting part.SOLUTION: A die mounting part has a feeding electrode 31 and a plurality of detection electrodes 32. When mounting a die having a power receiving electrode and a displacement electrode to the die mounting part, the feeding electrode 31 faces the power receiving electrode and the detection electrode 32 faces the displacement electrode to thereby form a capacitor circuit. A die position/width detection unit 11 supplies an AC feeding signal to the feeding electrode 31. A voltage information extraction part 330 extracts three voltage information from the detection electrodes 32, the information that is first voltage information having a level exceeding a threshold level, second voltage information having a leakage signal level smaller than the threshold level, and third voltage information having a level smaller than the leakage signal level. A position/width detection calculation part 111 detects the width of the die, based on the first and third voltage information.
申请公布号 JP5978102(B2) 申请公布日期 2016.08.24
申请号 JP20120242418 申请日期 2012.11.02
申请人 株式会社アマダホールディングス 发明人 権藤 雅彦;菅野 和宏
分类号 B21D5/02;G01B7/02 主分类号 B21D5/02
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