发明名称 チップ型電子部品の製造方法及び表面処理装置
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip-type electronic component and a surface treatment apparatus, which are capable of improving smoothness of an electrode without damaging a chip element.SOLUTION: The method for manufacturing a chip-type electronic component comprises the steps of: storing a plurality of chip elements on the outer surfaces of which electrode films formed of a metal are formed and an ultrasonic conducting liquid 11 in a container 12; and applying ultrasonic vibration to the container 12. The chip elements are vibrated by the ultrasonic vibration from an ultrasonic oscillator 16 to rub against each other. Preferably, the ultrasonic conducting liquid 11 is an organic solvent.
申请公布号 JP5979479(B2) 申请公布日期 2016.08.24
申请号 JP20120070534 申请日期 2012.03.27
申请人 三菱マテリアル株式会社 发明人 大井 幸二;山本 憲治
分类号 H01C17/28 主分类号 H01C17/28
代理机构 代理人
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