| 摘要 |
PROBLEM TO BE SOLVED: To provide a camera mount structure enabling easy position adjustment of an imaging plane including gate and flange back adjustment.SOLUTION: A solid-state imaging element package 20 includes: a package frame 21 having a frame-shaped surrounding wall 211; a terminal wiring board (lead frame) 22 having an inner lead and an outer lead; a rectangular parallelepiped die (chip) 23 mounted on the die pad of the terminal wiring board 22 and having an imaging plane 231; a plurality of flexible bonding wires 24 respectively for wiring connection between a plurality of bonding pads (electrode pads) disposed on the die 23 and a plurality of lead electrodes (inner leads) disposed on the terminal wiring board; and a plurality of first and second actuators 60, 65 for retaining the die 23 on the terminal wiring board 22 in such a manner that the position and the posture of the die 23 in the package is adjustable to the direction of an optical axis (o1) and a direction orthogonal to the optical axis (o1). |
