RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

The present invention relates to a resin composition for a printed circuit board, an insulation film, and a printed circuit board using the same. According to an embodiment of the present invention, the resin composition comprises: a resin having a polycyclic structure; a resin including an imide group having a polycyclic structure; and a hardening accelerator including at least two functional groups. The resin composition does not include a hardening agent. The resin composition has high storage stability, excellent workability, and excellent thermal characteristics at room temperature.