发明名称 電子回路モジュール部品及び電子回路モジュール部品の製造方法
摘要 PROBLEM TO BE SOLVED: To improve the heat resistance and the cyclic bending strength of a joining metal for joining a terminal electrode of an electronic component of an electronic circuit module component with a terminal electrode of a circuit board.SOLUTION: An electronic circuit module component includes: an electronic component 2; a circuit board 3 mounted with the electronic component 2; and joining metal 5 which is interposed between a terminal electrode 2T of the electronic component 2 and a terminal electrode 3T of the circuit board 3, and which joins both. In the joining metal 5, a main phase mainly consisting of Ni-Sn alloy and a second phase mainly consisting of either Bi or Zn are dispersed.
申请公布号 JP5978630(B2) 申请公布日期 2016.08.24
申请号 JP20120014550 申请日期 2012.01.26
申请人 TDK株式会社 发明人 安井 勉;室井 雅之;北村 智子;吉田 健一;阿部 寿之
分类号 B23K35/22;B22F1/00;B23K35/26;B23K35/30;C22C13/02;C22C19/03;H01L21/60 主分类号 B23K35/22
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