| 发明名称 |
SIGNAL DELIVERY IN STACKED DEVICE |
| 摘要 |
Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice. |
| 申请公布号 |
US2016240515(A1) |
申请公布日期 |
2016.08.18 |
| 申请号 |
US201615137931 |
申请日期 |
2016.04.25 |
| 申请人 |
Micron Technology, Inc. |
发明人 |
Keeth Brent;Hiatt Mark;Lee Terry R.;Tuttle Mark;Advani Rahul;Schreck John F. |
| 分类号 |
H01L25/065;H01L23/66;H01L23/50 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system comprising:
a processor; a memory device enclosed in an integrated circuit package with the processor and including a die with conductive paths at least partly through the die; a base arranged in a stack with the memory device and the processor and configured to receive signals; and a structure located in the stack and outside at least one of the processor and the memory device and configured to transfer at least one subset of the signals between the base and at least one of the processor and the memory device. |
| 地址 |
Boise ID US |
