Method and Apparatus for Planarizing Material Layers

摘要

A processing chamber is disclosed for planarizing material layers (for example, polymer layers). An exemplary processing chamber includes a substrate table configured to support a substrate having a material layer formed thereover and a flattening structure having a substantially flat surface. The flattening structure moves freely with respect to a non-uniform surface of the material layer, such that the non-uniform surface is flattened as the substantially flat surface contacts the non-uniform surface. In some implementations, the processing chamber further includes a pressing mechanism operatively coupled to the flattening structure, and a pivotal interface coupling the flattening structure to the pressing mechanism. The pressing mechanism presses the substantially flat surface of the flattening structure to the non-uniform surface of the material layer, and the pivotal interface allows the flattening structure to pivot with respect to the pressing mechanism and with respect to the substrate.

主权项

1. A processing chamber configured for planarizing material layers, the processing chamber comprising:
a substrate table configured to support a substrate having a material layer formed thereover; and a flattening structure having a substantially flat surface, wherein the flattening structure is configured to move freely with respect to a non-uniform surface of the material layer, such that the non-uniform surface of the material layer is flattened as the substantially flat surface contacts the non-uniform surface of the material layer.