CHEMICAL MECHANICAL POLISHING CONDITIONER

摘要

Provided is a CMP conditioner comprising: a substrate, multiple abrasive bars, and multiple slide blocks. The substrate is divided into a central surface and an outer surface. The central surface is a recessed part. The outer surface encompasses the central surface. Multiple mounting holes are recessed from the outer surface. The abrasive bars are each respectively mounted in the mounting holes. Each of the multiple abrasive bars comprises a bar body and an abrasive particle. The abrasive particle is mounted on a top surface of the abrasive bar. The multiple slide blocks are distributed among the mounting holes of the outer surface. Each of the multiple slide blocks comprises a slide dressing surface. The present invention utilizes the slide blocks to reduce the contact between the substrate and a polishing mat efficiently. The slide blocks may decrease dissolving out of metal components within the substrate and the pollution induced.

主权项

1. A chemical mechanical polishing conditioner comprising:
a substrate being circular and comprising a central surface, an outer surface encompassing the central surface, and multiple mounting holes recessed from the outer surface; multiple abrasive bars respectively mounted in the mounting holes; each of the multiple abrasive bars comprising a bar body and an abrasive particle, the bar body comprising a top surface; the abrasive particle comprising a tip; the abrasive particle mounted on the top surface with the tip pointing away from the top surface; and multiple slide blocks mounted on the outer surface; each of the multiple slide blocks comprising a slide dressing surface facing away from the outer surface; the multiple slide blocks distributed among the mounting holes.