发明名称 SENSOR DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 The present invention relates to a sensor device which has high S/N and excellent temperature characteristics. This sensor device (100) is provided with: a semiconductor substrate (101); a first metal wiring layer (111) that is provided on the semiconductor substrate (101); a first insulating layer (121) that is provided on the first metal wiring layer (111); a compound semiconductor sensor element (131) that is provided on the first insulating layer (121); a second metal wiring layer (112) that is provided on the compound semiconductor sensor element (131) and the first insulating layer (121); and a second insulating layer (122) that is provided on the second metal wiring layer (112). A third insulating layer (123) is provided between the first metal wiring layer (111) and the second metal wiring layer (112), and the compound semiconductor sensor element (131) is provided within the third insulating layer (123).
申请公布号 WO2016129288(A1) 申请公布日期 2016.08.18
申请号 WO2016JP00726 申请日期 2016.02.12
申请人 ASAHI KASEI MICRODEVICES CORPORATION 发明人 NAKAMURA, Masahiro
分类号 H01L43/06;G01R33/07;G01R33/09;H01L43/08;H01L43/12;H01L43/14 主分类号 H01L43/06
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